| 초록 |
In this paper, we propose an optimal heat dissipation design for an air-cooled MCU for an electric two-wheeled vehicle. Changed parts were limited to heat sink parts and thermal glue parts. Thermal conductivity, surface area, weight (heat capacity), thickness, and shape were selected as detailed modifiers, and the effect of each factor was analyzed by analyzing the time to reach 130℃ of the MOSFET device of each detail modifier. Although all the change factors affected the time to reach 130℃, the factor having the greatest influence was identified as the weight (thermal capacity) of the heat sink part. However, since the weight of the heat sink has a great influence on the material cost of the part, it can be said that an optimal cooling design plan considering the material cost is necessary. |
