| 초록 |
At present, the use of wireless chargers for smartphones has been increasing. Wireless chargers, however, generate high temperatures during the charging process, thus negatively impacting chargers and smartphones. Previous studies have confirmed that heat could affect the PCB(printed circuit board) and cause deformation. Building upon prior research, this study aimed to examine the deformation of the product attributed to the electromagnetic field of the wireless charger coil, as well as the thermal stress experienced by the PCB. These investigations were conducted through a multi-physics field analysis, encompassing electromagnetic field analysis, thermal analysis, structural analysis, and thermal-structural analysis. Finally, this study verified that the thermal deformation prediction results of the electromagnetic-thermal-structural coupling analysis of the coils in the wireless charging module were very similar to the thermal deformation measurements obtained through DIC. |
